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Years Active: 2017
Title: Keiichiro Tsutsumi: Innovator in Room Temperature Bonding Technology
Introduction
Keiichiro Tsutsumi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technology, particularly with his innovative approach to room temperature bonding methods. His work has implications for various industries, enhancing the efficiency and effectiveness of substrate bonding processes.
Latest Patents
Tsutsumi holds a patent for a "Room temperature bonding apparatus and room temperature bonding method." This invention features a room temperature bonding apparatus that includes a first beam source, a second beam source, and a press bonding mechanism. The first beam source emits a first activation beam that irradiates a first surface of a first substrate. Independently, the second beam source emits a second activation beam that irradiates a second surface of a second substrate. The press bonding mechanism facilitates the bonding between the first substrate and the second substrate by ensuring contact between the first and second surfaces after they have been irradiated. This technology allows for the appropriate bonding of multiple substrates made from different materials.
Career Highlights
Throughout his career, Keiichiro Tsutsumi has worked with prominent organizations, including Mitsubishi Heavy Industries Machine Tool Co., Ltd. and the National Institute of Advanced Industrial Science and Technology. His experience in these institutions has contributed to his expertise in advanced industrial technologies and innovations.
Collaborations
Tsutsumi has collaborated with notable colleagues such as Masato Kinouchi and Takayuki Goto. These partnerships have likely enriched his research and development efforts, leading to advancements in bonding technologies.
Conclusion
Keiichiro Tsutsumi's contributions to room temperature bonding technology exemplify his innovative spirit and dedication to advancing industrial processes. His patent and career achievements reflect his significant role in the field of bonding technology.
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