The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
May. 09, 2016
Applicants:
Mitsubishi Heavy Industries Machine Tool Co., Ltd., Ritto-shi, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Inventors:
Jun Utsumi, Yokohama, JP;
Takayuki Goto, Yokohama, JP;
Kensuke Ide, Ritto, JP;
Masahiro Funayama, Yokohama, JP;
Hideki Takagi, Tsukuba, JP;
Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B32B 38/00 (2006.01); B23K 20/02 (2006.01); B23K 20/22 (2006.01); B81C 3/00 (2006.01); B32B 37/14 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0008 (2013.01); B23K 20/02 (2013.01); B23K 20/22 (2013.01); B32B 37/14 (2013.01); B81C 3/001 (2013.01); C23C 14/14 (2013.01); C23C 14/3414 (2013.01); C23C 14/58 (2013.01); B32B 2457/00 (2013.01); B81C 2203/032 (2013.01); Y10T 428/31678 (2015.04);
Abstract
An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiOsubstrates) are bonded at room-temperature to have practical bonding strength.