The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Aug. 29, 2014
Applicant:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Sung Won Youn, Ibaraki, JP;

Sang Cheon Park, Ibaraki, JP;

Hiroshi Hiroshima, Ibaraki, JP;

Hideki Takagi, Ibaraki, JP;

Kenta Suzuki, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); G03F 7/00 (2006.01); B29C 35/08 (2006.01); B29C 43/02 (2006.01); B29C 43/52 (2006.01); G03F 7/038 (2006.01); C08L 79/08 (2006.01); B29K 79/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/022 (2013.01); B29C 35/0805 (2013.01); C08L 79/08 (2013.01); G03F 7/0002 (2013.01); G03F 7/0387 (2013.01); B29C 43/021 (2013.01); B29C 43/52 (2013.01); B29C 2035/0827 (2013.01); B29C 2043/025 (2013.01); B29C 2059/023 (2013.01); B29K 2079/08 (2013.01);
Abstract

Provided is a method for forming a pattern of polyimide that is simpler and is more excellent in the pattern shape and in the dimensional accuracy in comparison with the conventional techniques of patterning polyimide, such as photolithography and laser processing. In a method for forming a micropattern of polyimide, which includes using as polyimide a solvent-soluble polyimide resin composition that is photosensitive and is moldable at a temperature of less than or equal to a glass-transition temperature; patterning the composition using thermal imprinting; and thermally curing the composition, ultraviolet irradiation is performed after the composition is released from a mold after a molding step.


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