This inventor holds 17 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004-2011
Areas of Expertise:
Title: The Innovative Contributions of Inventor Gwo-Liang Weng
Introduction
Gwo-Liang Weng is a prominent inventor based in Kaohsiung, Taiwan. With a remarkable portfolio of 17 patents, he has made significant strides in the fields of semiconductor packaging and device manufacturing. His dedication to innovation has had a profound impact on technology and engineering practices.
Latest Patents
Among his latest inventions is a patent for a "Package structure and manufacturing method thereof." This invention introduces a novel package structure featuring a substrate, a chip, and a packing material layer. The design ensures that a body portion covers at least part of the chip and substrate while an extending portion, made of transparent material, projects from the body and covers the substrate's lateral surface.
Another important patent by Weng details a "Method of making a semiconductor package and method of making a semiconductor device." This comprehensive method involves various steps, including the attachment of a chip to a substrate, the formation of connecting elements, and encapsulating the assembly with a molding compound. The innovative approach protects the bonding pads on the substrate from contamination, thereby enhancing the overall reliability of semiconductor devices.
Career Highlights
Gwo-Liang Weng is currently employed at Advanced Semiconductor Engineering, Inc. His expertise in semiconductor technology and packaging has made him a valuable asset to the company. Through his innovative designs and methods, Weng continues to push the boundaries of what is possible within the semiconductor industry.
Collaborations
Throughout his career, Weng has collaborated with notable colleagues, including Yung-Li Lu and Shih-Chang Lee. Together, they have contributed to groundbreaking advancements in semiconductor manufacturing, reinforcing the importance of teamwork in driving innovation.
Conclusion
Gwo-Liang Weng's contributions to the field of semiconductor technology are marked by his 17 patents, showcasing his relentless pursuit of innovation. His latest inventions underline the importance of efficient and effective packaging methods in electronic devices. As technology continues to evolve, Weng’s work promises to play a pivotal role in the future of electronics and semiconductor applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile