The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2007

Filed:

Jan. 28, 2005
Applicants:

Gwo-liang Weng, Kaohsiung, TW;

Che-ya Chou, Kaohsiung, TW;

Shih-chang Lee, Kaohsiung, TW;

Inventors:

Gwo-Liang Weng, Kaohsiung, TW;

Che-Ya Chou, Kaohsiung, TW;

Shih-Chang Lee, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A contact sensor chip package includes a substrate, a contact sensor chip, a ground member and an encapsulation. The contact sensor chip is disposed on the substrate, and the contact sensor chip has a sensor area. The ground member is disposed on the ground pad of the substrate, and the ground member is electrically connected to the ground pad. The encapsulation covers the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.


Find Patent Forward Citations

Weng, Gwo-Liang. (2007). Contact sensor package (U.S. Patent No. 7193282). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7193282

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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