The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Dec. 13, 2006
Gwo-liang Weng, Kaohsiung, TW;
Cheng-yin Lee, Tainan, TW;
Gwo-Liang Weng, Kaohsiung, TW;
Cheng-Yin Lee, Tainan, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A manufacturing method of a package structure is provided. Firstly, a substrate having a surface is provided. Next, a chip is disposed on the surface of the substrate. Then, a packing material layer is formed on the surface of the substrate. Next, a this film is pasted on the packing material layer. Then the substrate and the packing material layer are thoroughly cut along a cutting line around the chip by a first cutting blade but the thin film is not cut thoroughly. Next, the substrate is thoroughly cut along at least a part of the cutting line by a second cutting blade but the packing material layer is not thoroughly cut such that a part of the packing material layer is exposed. The width of the second cutting blade is larger than the width of the first cutting blade.