The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Aug. 14, 2006
Yung-li LU, Kaohsiung Hsien, TW;
Gwo-liang Weng, Kaohsiung, TW;
Ying-tsai Yeh, Kaohsiung Hsien, TW;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
A chip package and a package process thereof are provided. The chip package comprises a package substrate, a chip, a plurality of spacers, an adhesive layer, and a plurality of wires. The package substrate has a carrying surface. The chip is disposed on the carrying surface. The spacers are formed between the chip and the carrying surface to maintain an interval between the chip and the package substrate. The adhesive layer is disposed between the chip and carrying surface to encapsulate the spacers. The chip is electrically connected to the package substrate via the wires.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile