The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Aug. 17, 2004
Gwo-liang Weng, Kaohsiung, TW;
Ching-hui Chang, Kaohsiung, TW;
Yung-li LU, Linyuan Township, Kaohsiung County, TW;
Yu-wen Chen, Kaohsiung, TW;
Gwo-Liang Weng, Kaohsiung, TW;
Ching-Hui Chang, Kaohsiung, TW;
Yung-Li Lu, Linyuan Township, Kaohsiung County, TW;
Yu-Wen Chen, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A joint area is formed between the first surface of the semiconductor and the upper surface of the substrate. Several solder bumps are disposed in the joint area, for electrically connecting the semiconductor component and the substrate. The underfill is filled in the joint area, for coating the solder bumps and tightly jointing the semiconductor component and the substrate. The buffer means is situated in the jointing area, for buffering the underfill to be confined in the joint area. Several solder balls are disposed on the lower surface of the substrate.