This inventor holds 1 USPTO granted patent. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2006.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2006
Title: Ching-Hui Chang: Innovator in Semiconductor Packaging
Introduction
Ching-Hui Chang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of semiconductor package structures. His innovative designs have the potential to enhance the performance and reliability of electronic devices.
Latest Patents
Ching-Hui Chang holds a patent for a semiconductor package structure. This structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is positioned beneath the semiconductor component, creating a joint area between the first surface of the semiconductor and the upper surface of the substrate. Several solder bumps are strategically placed in the joint area to facilitate electrical connections between the semiconductor component and the substrate. The underfill material fills the joint area, coating the solder bumps and ensuring a tight bond between the semiconductor component and the substrate. Additionally, the buffer means is located in the joint area to help confine the underfill. Several solder balls are positioned on the lower surface of the substrate, completing the package structure.
Career Highlights
Ching-Hui Chang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His work has contributed to advancements in the efficiency and effectiveness of semiconductor devices.
Collaborations
Ching-Hui Chang has collaborated with notable colleagues, including Gwo-Liang Weng and Yung-Li Lu, who have also made significant contributions to the field of semiconductor technology.
Conclusion
Ching-Hui Chang's innovative work in semiconductor packaging exemplifies the importance of advancements in technology. His patent for a semiconductor package structure showcases his commitment to improving electronic device performance. Through his contributions, he continues to influence the semiconductor industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile