The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Sep. 07, 2004
Chi Chih Chu, Kaohsiung, TW;
Cheng-yin Lee, Tainan, TW;
Gwo-liang Weng, Kaohsiung, TW;
Shih-chang Lee, Kaohsiung, TW;
Chi Chih Chu, Kaohsiung, TW;
Cheng-Yin Lee, Tainan, TW;
Gwo-Liang Weng, Kaohsiung, TW;
Shih-Chang Lee, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.