The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Jul. 26, 2007
Yen-yi Wu, Kao-Hsiung, TW;
Wei-yueh Sung, Ping-Tung, TW;
Pao-huei Chang Chien, Kaohsiung County, TW;
Chi-chih Chu, Kao-Hsiung, TW;
Cheng-yin Lee, Tai-Nan, TW;
Gwo-liang Weng, Kao-Hsiung, TW;
Yen-Yi Wu, Kao-Hsiung, TW;
Wei-Yueh Sung, Ping-Tung, TW;
Pao-Huei Chang Chien, Kaohsiung County, TW;
Chi-Chih Chu, Kao-Hsiung, TW;
Cheng-Yin Lee, Tai-Nan, TW;
Gwo-Liang Weng, Kao-Hsiung, TW;
Abstract
The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.