The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Jun. 14, 2004
Gwo-liang Weng, Kaohsiung, TW;
Yung-li LU, Linyuan Township, Kaohsiung County, TW;
Chi-chih Chu, Kaohsiung, TW;
Shih-chang Lee, Kaohsiung, TW;
Gwo-Liang Weng, Kaohsiung, TW;
Yung-Li Lu, Linyuan Township, Kaohsiung County, TW;
Chi-Chih Chu, Kaohsiung, TW;
Shih-Chang Lee, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.