The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2009
Filed:
Dec. 21, 2006
Gwo-liang Weng, Kaohsiung, TW;
Yung-li LU, Kaohsiung, TW;
Gwo-Liang Weng, Kaohsiung, TW;
Yung-Li Lu, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A chip package including a package substrate, a chip, several bonding wires, a flash-resisting ring and a molding compound. The package substrate includes a carrying surface and several contacts disposed on the carrying surface. The chip is disposed on the carrying surface. A surface of the chip away from the package substrate includes an active region and several bonding pads. The bonding pads are located outside the active region. The bonding wires connect the bonding pads and the contacts. The flash-resisting ring disposed on the chip is located between the bonding pads and the active region. The flash-resisting ring surrounding the active region includes at least one buffer groove. The buffer groove surrounds the active region. The molding compound disposed on the package substrate and the chip encapsulates at least the bonding pads, the contacts and the bonding wires. The molding compound exposes the active region.