The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Nov. 02, 2005
Gwo-liang Weng, Kao-Hsiung, TW;
Yung-li LU, Kao-Hsiung Hsien, TW;
Ying-tsai Yeh, Kao-Hsiung Hsien, TW;
Gwo-Liang Weng, Kao-Hsiung, TW;
Yung-Li Lu, Kao-Hsiung Hsien, TW;
Ying-Tsai Yeh, Kao-Hsiung Hsien, TW;
Advanced Semiconductor Engineering, Inc., Kao-Hsiung, TW;
Abstract
A sensor chip for defining an exposed molding region is disclosed. The sensor chip includes a semiconductor chip and a metal dam bar protruding from the active surface of the semiconductor chip. The active surface of the semiconductor chip includes a sensing region and at least one bonding pad is disposed on the active surface. The metal dam bar separates the sensing region and the bonding pad to prevent contamination of the sensing region by the mold flash. Preferably, a step is formed on the periphery of the active surface of the semiconductor chip, such that the semiconductor chip includes a T-shaped profile. Additionally, the metal dam bar is extended to the step to form an enclosed ring thereby effectively defining an exposed molding region that contains the sensing region.