IDiyas

For the Inventor, By the Inventor

Wuppertal, Germany

Gerald Ofner

USPTO Granted Patents = 45 

 

Average Co-Inventor Count = 4.0

ph-index = 13

Forward Citations = 536(Granted Patents)


Location History:

  • Bad Abbach, DE (2004 - 2009)
  • Mandarin Gardens, SG (2009)
  • Singapore, SG (2008 - 2013)
  • Regensburg, DE (2011 - 2023)

Company Filing History:

goldMedal24 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal14 out of 54,664 
 
Intel Corporation
 patents
bronzeMedal3 out of 511 
 
Intel Mobile Communications Gmbh
 patents
4. 3 out of 254 
 
Intel Deutschland Gmbh
 patents
5. 1 out of 30,028 
 
Siemens Aktiengesellschaft
 patents

Years Active: 2004-2023

where 'Filed Patents' based on already Granted Patents

45 patents (USPTO):
1. 11652084 - Flat lead package formation method (2023-05-16),
2. 11302668 - Multi-purpose non-linear semiconductor package assembly line (2022-04-12),
3. 10903166 - Integrated circuit packages (2021-01-26),
4. 10707158 - Package with vertical interconnect between carrier and clip (2020-07-07),
5. 10566309 - Multi-purpose non-linear semiconductor package assembly line (2020-02-18),
6. 10522454 - Microelectronic package having a passive microelectronic device disposed within a package body (2019-12-31),
7. 10301176 - Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) (2019-05-28),
8. 10228725 - Flexible band wearable electronic device (2019-03-12),
9. 10211182 - Package-on-package stacked microelectronic structures (2019-02-19),
10. 10157869 - Integrated circuit package (2018-12-18),
11. 10150668 - Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) (2018-12-11),
12. 9997444 - Microelectronic package having a passive microelectronic device disposed within a package body (2018-06-12),
13. 9888577 - Passive electrical devices with a polymer carrier (2018-02-06),
14. 9856136 - Chip arrangement and method for manufacturing a chip arrangement (2018-01-02),
15. 9663353 - Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) (2017-05-30),

Title: The Innovative Journey of Inventor Gerald Ofner

Introduction: Gerald Ofner, a talented inventor hailing from Wuppertal, Germany, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Gerald Ofner's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a novel renewable energy solution that promises to reshape the future of sustainable power generation.

Career Highlights: With a career spanning over two decades, Gerald Ofner has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them. His work has not only earned him recognition within the industry but has also improved the lives of countless individuals around the world.

Collaborations: Throughout his career, Gerald Ofner has collaborated with leading technology companies, research institutions, and universities to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many of his projects.

Conclusion: In conclusion, Gerald Ofner's passion for innovation and his relentless pursuit of excellence have solidified his position as a prominent figure in the world of technology. His contributions have had a lasting impact on the industry, and his inventive spirit continues to inspire future generations of inventors.

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