The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Oct. 23, 2020
Infineon Technologies Ag, Neubiberg, DE;
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Stephan Bradl, Regensburg, DE;
Stefan Miethaner, Regensburg, DE;
Alexander Heinrich, Bad Abbach, DE;
Horst Theuss, Wenzenbach, DE;
Peter Scherl, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.