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For the Inventor, By the Inventor

Wuppertal, Germany

Stefan Miethaner

USPTO Granted Patents = 11

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 114(Granted Patents)


Company Filing History:

goldMedal11 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 2002-2025

where 'Filed Patents' based on already Granted Patents

11 patents (USPTO):
1. 12288727 - Method of manufacturing a package having an adhesion promoter (2025-04-29),
2. 11652084 - Flat lead package formation method (2023-05-16),
3. 11652012 - Inorganic encapsulant for electronic component with adhesion promoter (2023-05-16),
4. 11302668 - Multi-purpose non-linear semiconductor package assembly line (2022-04-12),
5. 11069626 - Molding compound and semiconductor package with a molding compound (2021-07-20),
6. 10566309 - Multi-purpose non-linear semiconductor package assembly line (2020-02-18),
7. 10497587 - Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials (2019-12-03),
8. 7408803 - Method for writing to magnetoresistive memory cells and magnetoresistive memory which can be written to by the method (2008-08-05),
9. 6943393 - Memory cell arrangement and method of fabricating it (2005-09-13),
10. 6574138 - Memory cell configuration and method for operating the configuration (2003-06-03),
11. 6458603 - Method of fabricating a micro-technical structure, and micro-technical component (2002-10-01),

Title: The Innovative Contributions of Stefan Miethaner

Introduction

Stefan Miethaner is a prominent inventor based in Wuppertal, Germany. He has made significant contributions to the field of electronics, holding a total of 11 patents. His work focuses on enhancing the performance and reliability of electronic components through innovative packaging methods.

Latest Patents

Among his latest patents is a method of manufacturing a package that includes an adhesion promoter. This method involves forming an adhesion promoter on at least part of an electronic component. The adhesion promoter features a morphological structure with multiple openings, which enhances adhesion between the electronic component and an inorganic encapsulant. Another notable patent is for an inorganic encapsulant designed for electronic components, which also incorporates an adhesion promoter to improve the bond between the encapsulant and the electronic component.

Career Highlights

Stefan Miethaner is currently employed at Infineon Technologies AG, a leading company in the semiconductor industry. His role involves developing advanced packaging solutions that contribute to the efficiency and durability of electronic devices. His innovative approaches have positioned him as a key figure in the field of electronics.

Collaborations

Stefan has collaborated with notable colleagues such as Siegfried Schwarzl and Thorsten Meyer. Their combined expertise has led to the development of cutting-edge technologies that push the boundaries of electronic component design.

Conclusion

Stefan Miethaner's contributions to the field of electronics through his patents and work at Infineon Technologies AG highlight his role as an influential inventor. His innovative methods for packaging electronic components continue to enhance the industry.

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