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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11069626 B1

PDFFull Text
Date of Patent:
Jul. 20, 2021

Filed:

Apr. 16, 2019

Molding compound and semiconductor package with a molding compound

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Anton Mauder, Kolbermoor, DE;

Oliver Hellmund, Neubiberg, DE;

Peter Irsigler, Obernberg/lnn, AT;

Hanno Melzner, Putzbrunn, DE;

Stefan Miethaner, Regensburg, DE;

Sebastian Schmidt, Munich, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Theresa T Doan

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 23/49562 (2013.01); H01L 23/49844 (2013.01); H01L 23/562 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/351 (2013.01);
Abstract

A molding compound and a semiconductor arrangement with a molding compound are disclosed. The molding compound includes a matrix and a filler including filler particles. The filler particles each include a core with an electrically conducting or a semiconducting material and an electrically insulating cover.

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Quick Actions:

Mauder, Anton. (2021). Molding compound and semiconductor package with a molding compound (U.S. Patent No. 11069626). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11069626

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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