The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Dec. 19, 2019
Infineon Technologies Ag, Neubiberg, DE;
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Stephan Bradl, Regensburg, DE;
Stefan Miethaner, Regensburg, DE;
Alexander Heinrich, Bad Abbach, DE;
Horst Theuss, Wenzenbach, DE;
Peter Scherl, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of producing packaged semiconductor devices includes providing a first packaging substrate panel, providing a second packaging substrate panel, and moving the first and second packaging substrate panels through an assembly line that comprises a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner. The first and second packaged semiconductor devices differ with respect to at least one of: lead configuration, and encapsulant configuration.