The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Oct. 04, 2016
Infineon Technologies Ag, Neubiberg, DE;
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Peter Scherl, Regensburg, DE;
Stephan Bradl, Regensburg, DE;
Stefan Miethaner, Regensburg, DE;
Alexander Heinrich, Bad Abbach, DE;
Horst Theuss, Wenzenbach, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of producing packaged semiconductor devices includes providing a first packaging substrate panel. A second packaging substrate panel is provided. The first and second packaging substrate panels are moved through an assembly line that includes a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The second type packaged semiconductor device is different than the first type packaged semiconductor device. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner.