The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Mar. 28, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Sven Albers, Regensburg, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/49822 (2013.01); H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H05K 1/0292 (2013.01); H05K 1/165 (2013.01); H01L 21/568 (2013.01); H01L 23/49827 (2013.01); H01L 24/00 (2013.01); H01L 24/96 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19105 (2013.01); H05K 1/0233 (2013.01); H05K 1/162 (2013.01); H05K 1/185 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/171 (2013.01); H05K 2203/173 (2013.01); H05K 2203/175 (2013.01); Y02P 70/611 (2015.11);
Abstract
Passive electrical devices are described with a polymer carrier. In one example, a conductive layer is formed over a polymer substrate in a pattern to form a passive electrical device and at least two terminals of the device. A plurality of external connection pads are connected to the terminals of the device.