The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Jun. 05, 2013
Applicant:
Intel Mobile Communications Gmbh, Neubiberg, DE;
Inventors:
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Christian Mueller, Bottrop, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Christian Geissler, Teugn, DE;
Andreas Augustin, Munich, DE;
Assignee:
Intel Deutschland GmbH, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0077 (2013.01); B81B 7/007 (2013.01); B81C 1/00333 (2013.01); H01L 24/19 (2013.01); B81B 2207/012 (2013.01); B81B 2207/095 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
A chip arrangement may include: a mold compound; and a microelectromechanical systems device at least partially embedded in the mold compound.