Daeik Daniel Kim

This inventor holds 102 USPTO granted patents and 21 published patent applications, plus 1 CIPO patent and 19 EPO patents, primarily in Inductor Technology (CPC class H01L28-10). Top assignees: Qualcomm Incorporated, International Business Machines Corporation. Active years: 2009-2021.

USPTO Granted Patents = 102 (Patent Applications = 21)

% Patents Active = 63.7

CIPO Patents = 1 (Patent Applications = 4)

EPO Patents = 19 (Patent Applications = 42)

Average Co-Inventor Count = 5.5

ph-index = 9

Forward Citations = 912(Granted Patents)

Forward Citations (Not Self Cited) = 879(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Fishkill, NY (US) (2009 - 2015)
Beacon, NY (US) (2010 - 2015)
West Lafayette, IN (US) (2015 - 2016)
White Plains, NY (US) (2010 - 2018)
San Diego, CA (US) (2015 - 2019)
Del Mar, CA (US) (2016 - 2021)

Company Filing History:

76 out of 44,618

Qualcomm Incorporated

patents

26 out of 166,159

International Business Machines Corporation

patents

Years Active: 2009-2021

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Areas of Expertise:

High Performance Inductors

RF Structures

Passive-On-Glass

Embedded Inductor

3D Inductor

Power Amplifier

Thermal Management

Capacitance

Multiplexer Design

Integrated Circuits

Thin Film Magnet

Dielectric Capacitor

102 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11024454 - High performance inductors (2021-06-01),

2. 10978240 - Inductor with embraced corner capture pad (2021-04-13),

3. 10832848 - Low DC resistance and high RF resistance power amplifier choke inductor (2020-11-10),

4. 10607980 - Passive-on-glass (POG) device and method (2020-03-31),

5. 10553671 - 3D pillar inductor (2020-02-04),

6. 10511268 - Segmented thermal and RF ground (2019-12-17),

7. 10490348 - Two-dimensional structure to form an embedded three-dimensional structure (2019-11-26),

8. 10431511 - Power amplifier with RF structure (2019-10-01),

9. 10418333 - Waveguide along shielded side wall (2019-09-17),

10. 10361149 - Land grid array (LGA) packaging of passive-on-glass (POG) structure (2019-07-23),

11. 10354795 - Varying thickness inductor (2019-07-16),

12. 10332911 - Integrated circuits (ICs) on a glass substrate (2019-06-25),

13. 10332671 - Solenoid inductor (2019-06-25),

14. 10325859 - Shielded stacked substrate apparatus and method of fabricating (2019-06-18),

15. 10325855 - Backside drill embedded die substrate (2019-06-18),

Title: The Innovative Mind of Daeik Daniel Kim: A Patent Powerhouse from Del Mar, CA

Introduction: Daeik Daniel Kim, a prolific inventor based in Del Mar, CA, has made a significant mark in the world of high-performance inductors with a remarkable total of 102 patents to his name.

Latest Patents:

1. High Performance Inductors: Kim's invention features an inductor device with curved metal plates and elongated vias designed to improve conductivity, with a unique aspect ratio for enhanced performance.

2. Inductor with Embraced Corner Capture Pad: Another of Kim's patents showcases a laminate substrate inductor that enhances insertion loss reduction and isolation improvement within a smaller integration area.

Career Highlights: Kim's expertise and innovative spirit have been honed through his work at renowned companies such as Qualcomm Incorporated, known for cutting-edge technological advancements, and International Business Machines Corporation (IBM), a global leader in innovation.

Collaborations: Throughout his career, Kim has collaborated with notable colleagues such as Jonghae Kim and Changhan Hobie Yun, who have contributed to the success of his inventive endeavors.

Conclusion: Daeik Daniel Kim's groundbreaking work in high-performance inductors exemplifies his dedication to pushing the boundaries of technological innovation. With an impressive portfolio of patents and a history of collaboration with industry leaders, Kim continues to inspire advancements in the field of electrical engineering.