Changhan Hobie Yun

This inventor holds 129 USPTO granted patents and 50 published patent applications, plus 1 CIPO patent and 22 EPO patents, primarily in Passive Device Integration (CPC class H01L28-10). Top assignees: Qualcomm Incorporated, Qualcomm Mems Technologies, Inc., Analog Devices,inc.. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Changhan Hobie Yun. Retrieved from https://idiyas.com/inventor/changhan-hobie-yun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 129 (Patent Applications = 50)

% Patents Active = 72.1

CIPO Patents = 1 (Patent Applications = 4)

EPO Patents = 22 (Patent Applications = 64)

Average Co-Inventor Count = 6.0

ph-index = 9

Forward Citations = 1,135(Granted Patents)

Forward Citations (Not Self Cited) = 1,040(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Cambridge, MA (US) (2009)
San Jose, CA (US) (2019)
San Diego, CA (US) (2013 - 2024)

Company Filing History:

115 out of 45,060

Qualcomm Incorporated

patents

11 out of 577

Qualcomm Mems Technologies, Inc.

Rf360 Singapore Pte. Ltd.

patents

Years Active: 2009-2026

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Areas of Expertise:

Redistribution Layer

Integrated Passive Devices

Wideband Filter

Tunable Circuit

Metal-Insulator-Metal Capacitor

Chip Modules

Inductor Structures

Passive-On-Glass Device

Through Glass Via

3D Pillar Inductor

Acoustic Filter

Land Grid Array Packaging

129 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12677666 - Die edge protection to eliminate die chipping (2026-07-07),

2. 12519050 - Double-sided redistribution layer (RDL) substrate for passive and device integration (2026-01-06),

3. 12402332 - Integrated passive devices (2025-08-26),

4. 12341488 - Package comprising an acoustic device and a polymer cap layer (2025-06-24),

5. 12273095 - Wideband filter with resonators and inductors (2025-04-08),

6. 12016247 - Package comprising an integrated passive device configured as a cap for a filter (2024-06-18),

7. 12009292 - Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation (2024-06-11),

8. 11770115 - Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methods (2023-09-26),

9. 11728293 - Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component (2023-08-15),

10. 11658403 - Device, package and/or substrate comprising curved antenna (2023-05-23),

11. 11626236 - Stacked inductor having a discrete metal-stack pattern (2023-04-11),

12. 11515247 - Capacitance fine tuning by fin capacitor design (2022-11-29),

13. 11502652 - Substrate comprising capacitor configured for power amplifier output match (2022-11-15),

14. 11239158 - Wire bond inductor structures for flip chip dies (2022-02-01),

15. 11121699 - Wideband filter with resonators and inductors (2021-09-14),

Title: Changhan Hobie Yun: Innovating the Wireless World

Introduction:

Changhan Hobie Yun is a prominent inventor and engineer based in San Diego, California. With an impressive portfolio of 120 patents, Yun has made significant contributions to the field of wireless communication. His work primarily focuses on tunable circuits and integrated passive devices, revolutionizing the way mobile devices transmit and receive RF signals.

Latest Patents:

Yun's latest patents demonstrate his expertise in developing tunable circuits and integrated passive devices. Specifically, his patent titled "Tunable circuit including integrated filter circuit coupled to variable capacitance and related integrated circuit (IC) packages and fabrication methods" presents a novel approach to calibrating capacitance to account for manufacturing variations. This technology enables wireless devices to adjust to different frequency ranges used globally.

Another recent patent, "Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component," addresses the demand for miniaturization in mobile devices. Yun's innovation allows for the reduction in the sizes of chip modules by integrating passive components and other integrated circuits more efficiently.

Career Highlights:

Throughout his career, Changhan Hobie Yun has worked with renowned companies such as Qualcomm Incorporated and Qualcomm MEMS Technologies, Inc. (Qualcomm MEMS). These organizations, widely recognized for their contributions to the telecommunications industry, have created an ideal environment for Yun to explore his inventive ideas.

Collaborations:

Yun has been fortunate to collaborate with talented individuals within his field. Notable coworkers include Jonghae Kim and Chengjie Zuo, both of whom have contributed to the advancements made in wireless communication. The collaboration between these experts has played a vital role in the success and impact of Yun's patented innovations.

Conclusion:

Changhan Hobie Yun's impressive portfolio of 120 patents showcases his remarkable contributions to the wireless communication industry. His expertise in tunable circuits and integrated passive devices has revolutionized the way we transmit and receive RF signals in mobile devices. With collaborations alongside esteemed colleagues and experiences at leading companies, Yun continues to push boundaries and shape the future of wireless technology.

Profile summary based on public USPTO records.