The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Aug. 25, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Changhan Hobie Yun, San Diego, CA (US);

Daniel Daeik Kim, San Diego, CA (US);

Paragkumar Ajaybhai Thadesar, San Diego, CA (US);

Nosun Park, Incheon, KR;

Sameer Sunil Vadhavkar, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/38 (2006.01); H01Q 13/02 (2006.01); H01Q 21/28 (2006.01); H04B 3/52 (2006.01); H04B 3/56 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 13/02 (2013.01); H01Q 21/28 (2013.01); H04B 3/52 (2013.01); H04B 3/56 (2013.01);
Abstract

A substrate that includes at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the substrate. The curved antenna is curved relative to the surface of the substrate such that at least part of the curved antenna is offset from the surface of the substrate. The substrate includes a first antenna dielectric layer coupled to the surface of the substrate, an antenna ground interconnect coupled to the first antenna dielectric layer, and a second antenna dielectric layer coupled to the antenna ground interconnect. The antenna ground interconnect configured to be coupled to ground. The curved antenna is coupled to the second antenna dielectric layer.


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