The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Aug. 27, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Changhan Hobie Yun, San Diego, CA (US);

Nosun Park, Incheon, KR;

Daniel Daeik Kim, San Diego, CA (US);

Paragkumar Ajaybhai Thadesar, San Diego, CA (US);

Sameer Sunil Vadhavkar, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 30/00 (2023.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H10N 30/1051 (2023.02); H03H 9/02015 (2013.01); H03H 9/02535 (2013.01);
Abstract

A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The integrated passive device is coupled to the integrated device. The integrated passive device is configured as a cap for the integrated device. The void is located between the integrated device and the integrated passive device.


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