The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Apr. 27, 2022
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Sameer Sunil Vadhavkar, San Diego, CA (US);
Changhan Hobie Yun, San Diego, CA (US);
Paragkumar Ajaybhai Thadesar, San Diego, CA (US);
Nosun Park, Incheon, KR;
Daniel Daeik Kim, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/121 (2026.01);
Abstract
Disclosed is a device that includes a die and a protection layer surrounding the die. The protection layer is applied at a backend process prior to dicing a wafer to individual dies. The protection layer protects the die from chips and cracks during and after dicing the wafer.