The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Jun. 10, 2016
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Chengjie Zuo, Santee, CA (US);
Jonghae Kim, San Diego, CA (US);
Daeik Daniel Kim, Del Mar, CA (US);
Changhan Hobie Yun, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 49/02 (2006.01); H01L 21/48 (2006.01); H01F 17/00 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 23/64 (2006.01); H01F 27/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01L 21/486 (2013.01); H01L 21/4889 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/5227 (2013.01); H01L 23/642 (2013.01); H01L 24/17 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0073 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01);
Abstract
Base pads are spaced by a pitch on a support surface. Conducting members, optionally Cu or other metal pillars, extend up from the base pads to top pads. A top pad interconnector connects the top pads in a configuration establishing an inductor current path between the base pads.