The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Mar. 18, 2016
Qualcomm Incorporated, San Diego, CA (US);
Daeik Kim, Del Mar, CA (US);
Jie Fu, San Diego, CA (US);
Changhan Yun, San Diego, CA (US);
Chin-Kwan Kim, San Diego, CA (US);
Manuel Aldrete, Encinitas, CA (US);
Chengjie Zuo, Santee, CA (US);
Mario Velez, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A device and method of fabricating are provided. The device includes a substrate having a first side and an opposite second side, a cavity defined within the substrate from the first side, a die coupled to a floor of the cavity and having a conductive pad on a side of the die distal to the floor of the cavity. A laminate layer coupled to the second side of the substrate may be included. A hole may be drilled, at one time, through layers of the device, through the die, and through the conductive pad. The hole extends through and is defined within the laminate layer (if present), the second side of the substrate, the die, and the conductive pad. A conductive material is provided within the hole and extends between and through the laminate layer (if provided), the second side of the substrate, the die, and the conductive pad.