The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Aug. 19, 2016
Qualcomm Incorporated, San Diego, CA (US);
Daeik Daniel Kim, San Diego, CA (US);
Chengjie Zuo, Santee, CA (US);
Changhan Hobie Yun, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Robert Paul Mikulka, Oceanside, CA (US);
Xiangdong Zhang, Westford, MA (US);
Jonghae Kim, San Diego, CA (US);
Je-Hsiung Lan, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A method includes forming a first conductive spiral and a second conductive spiral of a spiral inductor coupled to a substrate. The second conductive spiral overlays the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate. The second thickness is greater than the first thickness. The portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.