The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Dec. 28, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Daeik Daniel Kim, Del Mar, CA (US);

Babak Nejati, San Diego, CA (US);

Husnu Ahmet Masaracioglu, La Jolla, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H05K 1/02 (2006.01); H01F 17/00 (2006.01); H05K 1/16 (2006.01); H01F 5/00 (2006.01); H04B 1/00 (2006.01); H04B 1/40 (2015.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 5/003 (2013.01); H01F 17/0013 (2013.01); H01F 27/2885 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 41/041 (2013.01); H04B 1/006 (2013.01); H04B 1/0064 (2013.01); H05K 1/0237 (2013.01); H05K 1/165 (2013.01); H01F 2017/008 (2013.01); H01F 2017/0073 (2013.01); H01F 2027/2809 (2013.01); H04B 1/40 (2013.01); H05K 1/0233 (2013.01); H05K 1/116 (2013.01); H05K 3/0026 (2013.01); H05K 3/429 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/09272 (2013.01); H05K 2201/09454 (2013.01);
Abstract

A laminate substrate inductor reduces insertion loss and improves isolation while reducing the area for integrating the laminate substrate inductor. The laminate substrate includes a spiral trace. The laminate substrate also includes a first capture pad at a first end of the spiral trace. The first end is located at a corner of the spiral trace. The first capture pad is substantially within a bounding box of the spiral trace. At least a portion of the first capture pad and an outer edge of the spiral trace have a same distance from a ground.


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