The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Jun. 24, 2016
Qualcomm Incorporated, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Daeik Daniel Kim, Del Mar, CA (US);
Niranjan Sunil Mudakatte, San Diego, CA (US);
David Francis Berdy, San Diego, CA (US);
Changhan Hobie Yun, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Chengjie Zuo, San Diego, CA (US);
Yunfei Ma, Ithaca, NY (US);
Robert Paul Mikulka, Oceanside, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.