Niskayuna, NY, United States of America

Chun Wing Yeung

This inventor holds 73 USPTO granted patents and 54 published patent applications and 1 EPO patent, primarily in Nanosheet Transistors (CPC class H01L). Top assignees: International Business Machines Corporation, Elpis Technologies Inc., Globalfoundries Inc.. Active years: 2017-2024.

USPTO Granted Patents = 73 

% Patents Active = 75.3

 

Average Co-Inventor Count = 3.7

ph-index = 9

Forward Citations = 301(Granted Patents)

Forward Citations (Not Self Cited) = 261(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Niskayuna, NY (US) (2017 - 2023)
  • Portland, OR (US) (2023 - 2024)

Company Filing History:


Years Active: 2017-2024

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Areas of Expertise:
III-V Nanosheet Devices
Vertical Field-Effect Transistor
Self-Aligned Transistors
Gate Fill Techniques
Contact Resistance Measurement
Bottom Channel Isolation
High-k Dielectric
Directed Self-Assembly
Semiconductor Fabrication
Nanosheet MOSFET
Epitaxial Growth
Fin Field-Effect Transistor
73 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Chun Wing Yeung - Pioneering Semiconductor Device Technologies

Introduction:

Chun Wing Yeung, a talented inventor based in Niskayuna, NY, has made significant contributions to the field of semiconductor device technologies. With an impressive portfolio of 73 patents, Yeung continues to drive innovation in the industry. Let's delve into his latest patents, career highlights, and collaborations that have shaped his prolific career.

Latest Patents:

Yeung's latest patents showcase his expertise in replacement-channel fabrication of III-V nanosheet devices. These semiconductor devices utilize a unique method of forming a stack of sacrificial layers to grow replacement channel layers and source/drain regions. By etching away sacrificial layers and forming gate stacks, Yeung's inventions demonstrate advanced techniques in semiconductor device fabrication.

Semiconductor device and method of forming the semiconductor device:

- Description: The semiconductor device includes SiGe fins with varying amounts of germanium, enhancing performance.

- Technical Details: The total width of the SiGe fins corresponds to the width of diffusion regions, optimizing device functionality.

Career Highlights:

Yeung has honed his skills and expertise while working at renowned companies such as IBM and Globalfoundries Inc. These experiences have provided him with valuable insights and opportunities to work on cutting-edge technologies in the semiconductor industry. Yeung's career highlights exemplify his commitment to excellence and innovation.

Collaborations:

Throughout his career, Yeung has collaborated with talented individuals such as Chen Zhang and Choonghyun Lee. Their combined efforts have resulted in groundbreaking advancements in semiconductor device technologies. By leveraging their diverse skills and knowledge, Yeung and his colleagues have achieved remarkable success in the field.

Conclusion:

Chun Wing Yeung's remarkable journey as an inventor underscores his passion for pushing the boundaries of semiconductor device technologies. With a strong focus on innovation and collaboration, Yeung continues to make significant contributions to the industry. His latest patents and career highlights serve as testaments to his dedication and expertise in driving technological advancements.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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