The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Mar. 13, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Zuoguang Liu, Schenectady, NY (US);

Richard Glen Southwick, III, Halfmoon, NY (US);

Xin Miao, Slingerlands, NY (US);

Chun Wing Yeung, Niskayuna, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); G01R 31/26 (2020.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/785 (2013.01); G01R 31/26 (2013.01); H01L 21/823412 (2013.01); H01L 22/14 (2013.01); H01L 29/41791 (2013.01); H01L 29/66666 (2013.01); H01L 29/66795 (2013.01); H01L 29/7827 (2013.01);
Abstract

Semiconductor device structures and techniques are provided for measuring contact resistance. A semiconductor device is disclosed including a first source/drain region and a contact disposed on the first source/drain region and configured to supply energy to the semiconductor device. A fin extends between the first source/drain region and a second source/drain region of the semiconductor device. A first contact material layer is disposed on the second source/drain region and a first active drain contact is disposed on the first contact material layer. A first sensor drain contact is also disposed on the first contact material layer. A second contact material layer is disposed on the second source/drain region and a second active drain contact is disposed on the second contact material layer. A third contact material layer is disposed on the second source/drain region and a second sensor drain contact is disposed on the third contact material layer.


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