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For the Inventor, By the Inventor

Miaoli, Taiwan

Cheng-Hsiung Tsai

This inventor holds 56 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Fabrication (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Hsiung Tsai. Retrieved from https://idiyas.com/inventor/cheng-hsiung-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 56 

% Patents Active = 62.5

Average Co-Inventor Count = 4.6

ph-index = 8

Forward Citations = 3,323(Granted Patents)

Forward Citations (Not Self Cited) = 3,156(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Chunan Town, Miaoli County, TW (2014 - 2015)
  • Chunan Town, TW (2014 - 2016)
  • Zhunan Township, TW (2015 - 2018)
  • Zhunan Township, Miaoli County, TW (2016 - 2022)
  • Miaoli, TW (2023)
  • Hsinchu, TW (2023)
  • Miaoli County, TW (2013 - 2024)

Company Filing History:

goldMedal56 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
Semiconductor Device
Integrated Circuit
Interconnect Structure
Self-Aligned Via
Spacer Etching
Air Gap Formation
Lithography
Metal Lines
Nano Gap
Patterning Process
Manufacturing Methods
Barrier Layer
56 patents (USPTO):Explore Patents
1. 12476142 - Semiconductor device structure and methods of forming the same (2025-11-18),
2. 12444676 - Self-aligned via for interconnect structure (2025-10-14),
3. 12165920 - Semiconductor structure and method for forming the same (2024-12-10),
4. 12046551 - Interconnect structure having a barrier layer along the sidewall of self-aligned via structures (2024-07-23),
5. 11854820 - Spacer etching process for integrated circuit design (2023-12-26),
6. 11830910 - Semiconductor structure having air gaps and method for manufacturing the same (2023-11-28),
7. 11676862 - Semiconductor device structure and methods of forming the same (2023-06-13),
8. 11631639 - Method of fabricating self-aligned via structures (2023-04-18),
9. 11569124 - Interconnect structure having an etch stop layer over conductive lines (2023-01-31),
10. 11532547 - Interconnect structures with low-aspect-ratio contact vias (2022-12-20),
11. 11393718 - Semiconductor structure and method for forming the same (2022-07-19),
12. 11251118 - Self-aligned via structures with barrier layers (2022-02-15),
13. 10861742 - Interconnect structure having an etch stop layer over conductive lines (2020-12-08),
14. 10665467 - Spacer etching process for integrated circuit design (2020-05-26),
15. 10312139 - Interconnect structure having an etch stop layer over conductive lines (2019-06-04),

Title: Innovator Spotlight: Cheng-Hsiung Tsai - Pioneering Semiconductor Technologies

Introduction:

Cheng-Hsiung Tsai is a visionary inventor based in Miaoli County, Taiwan, known for his groundbreaking work in the field of semiconductor technology. With an impressive portfolio of 52 patents, Tsai has been instrumental in developing cutting-edge processes that have revolutionized the integrated circuit design industry.

Latest Patents:

One of Tsai's latest patents includes a revolutionary Spacer Etching Process for integrated circuit design. This method involves intricate patterning processes to create dielectric spacer features, optimizing the spacing between trench patterns in semiconductor structures. Another notable patent is the Semiconductor Structure Having Air Gaps, a method that enhances semiconductor manufacturing by incorporating air gaps for improved performance.

Career Highlights:

Tsai is currently affiliated with Taiwan Semiconductor Manufacturing Company Ltd., a key player in the semiconductor industry. His expertise and innovative approach have significantly contributed to the company's success in pushing the boundaries of semiconductor technology.

Collaborations:

Throughout his career, Tsai has collaborated with talented individuals in the field, including Chung-Ju Lee and Tien-I Bao. These partnerships have led to the development of advanced technologies and novel solutions that have shaped the semiconductor landscape.

Conclusion:

Cheng-Hsiung Tsai's dedication to innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of semiconductor technology. His remarkable patents and collaborative efforts continue to drive progress and inspire future generations of inventors in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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