For the Inventor, By the Inventor

Enter assignee name

National Center for Advanced Packaging Co., Ltd

USPTO Granted Patents = 14

Forward Citations = 21

Loading Chart...

Loading Chart...

22 inventors (with patents filed for the assignee):

Wenqi Zhang (5 out of 9 patents)

Haiyun Xue (3 out of 3 patents)

Feng Chen (2 out of 2 patents)

4. Zhongyao Yu (2 out of 5 patents)

5. Daniel Guidotti (2 out of 12 patents)

6. Haiyang Gu (2 out of 2 patents)

7. Daquan Yu (2 out of 2 patents)

8. Yu Sun (1 out of 76 patents)

9. Tingyu Lin (1 out of 2 patents)

10. Feng Jiang (1 out of 4 patents)

11. Zhidan Fang (1 out of 1 patent)

12. Xueping Guo (1 out of 2 patents)

13. Hongjie Wang (1 out of 1 patent)

14. Yibo Liu (1 out of 1 patent)

15. Dongkai Shangguan (1 out of 1 patent)

14 patents: Sort by Forward Citations

1. 11854794 - Semiconductor cleaning equipment and method for cleaning through vias using the same (2023-12-26),

2. 11346920 - Radar component package and method for manufacturing the same (2022-05-31),

3. 10209467 - Active optical adapter plate and optical interconnection module (2019-02-19),

4. 10015889 - Method for constructing an external circuit structure (2018-07-03),

5. 9773684 - Method of manufacturing fan out wafer level package (2017-09-26),

6. 9653378 - Heat dissipation solution for advanced chip packages (2017-05-16),

7. 9638875 - Optical communication apparatus and method of assembling the same (2017-05-02),

8. 9589786 - Method for polishing a polymer surface (2017-03-07),

9. 9583418 - Chip embedded package method and structure (2017-02-28),

10. 9368376 - Mechanical debonding method and system (2016-06-14),

11. 9316793 - Oblique angle optical fiber assembly (2016-04-19),

12. 9293368 - Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing (2016-03-22),

13. 9177929 - Techniques for fabricating fine-pitch micro-bumps (2015-11-03),

14. 9076699 - TSV backside reveal structure and exposing process (2015-07-07),

National Center For Advanced Packaging Co., Ltd is a leading provider of advanced packaging solutions. With expertise in high-density interconnect (HDI) technology, the company offers innovative solutions for various industries, including semiconductor, electronics, and telecommunications. National Center For Advanced Packaging Co., Ltd is committed to delivering exceptional quality and performance through its state-of-the-art manufacturing facilities and cutting-edge research and development. Visit their website to learn more about their comprehensive range of packaging solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

14 Patents

#9 in Wuxi

#1,812 in China

#40,903 in the World

National Center for Advanced Packaging Co., Ltd

Forward Citations = 21

22 inventors:

Wenqi Zhang (5 out of 9 patents)

Haiyun Xue (3 out of 3 patents)

Feng Chen (2 out of 2 patents)

4. Zhongyao Yu (2 out of 5 patents)

5. Daniel Guidotti (2 out of 12 patents)

Please report any incorrect information to support@idiyas.com

Loading…