Yibo Liu

Title: Yibo Liu: Innovator in Advanced Packaging Technology

Introduction

Yibo Liu is a prominent inventor based in Wuxi, China. He has made significant contributions to the field of advanced packaging technology, particularly in the manufacturing of fan out wafer level packages. His innovative approach has the potential to simplify manufacturing processes while enhancing the performance of electronic components.

Latest Patents

Yibo Liu holds a patent for a method of manufacturing a fan out wafer level package. This method involves preparing conductive projections on the upper surface of a chip, mounting the chip on a carrier with the upper surface facing upwards, and plastic packaging the chip to form a plastic packaging body. The tops of the conductive projections are disposed outside the plastic package body, and redistribution line processing is implemented on the plastic package body. This technique allows for the production of smaller and thinner chips while simplifying the overall manufacturing process.

Career Highlights

Yibo Liu is associated with the National Center for Advanced Packaging Co., Ltd. His work at this institution has positioned him as a key figure in the development of advanced packaging solutions. His innovative methods are paving the way for advancements in the electronics industry.

Collaborations

Yibo Liu has collaborated with notable colleagues, including Hongjie Wang and Feng Chen. Their combined expertise contributes to the ongoing research and development in advanced packaging technologies.

Conclusion

Yibo Liu's contributions to the field of advanced packaging technology exemplify the impact of innovation on the electronics industry. His patented methods are set to revolutionize manufacturing processes, making them more efficient and effective.