The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Oct. 29, 2015
Applicant:
National Center for Advanced Packaging Co., Ltd., Wuxi, Jiangsu Province, CN;
Inventors:
Hongjie Wang, Wuxi, CN;
Yibo Liu, Wuxi, CN;
Feng Chen, Wuxi, CN;
Dongkai Shangguan, Wuxi, CN;
Peng Sun, Wuxi, CN;
Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/482 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/568 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A method of manufacturing a fan out wafer level package comprises: preparing conductive projections on an upper surface of a chip; mounting the chip on a carrier with the upper surface of the chip facing upwards; plastic packaging the chip to form a plastic packaging body with tops of the conductive projections being disposed outside the plastic package body; and implementing a redistribution line processing on the plastic package body. With this method, chips can be made small and thin and the manufacturing processes can be simplified.