Haiyang Gu

Title: Innovations by Inventor Haiyang Gu

Introduction

Haiyang Gu is a notable inventor based in Wuxi, China. He has made significant contributions to the field of polymer surface treatment and TSV exposing processes. With a total of two patents to his name, Gu's work addresses critical challenges in advanced packaging technologies.

Latest Patents

One of Gu's latest patents is a method for polishing a polymer surface. This method involves curing the polymer surface and then polishing it through a chemical mechanical polishing (CMP) process. The innovation improves the uniformity of the polymer surface to less than 1%, meeting the demands for high-density and small linewidth integration. Another significant patent is related to a TSV exposing process. This process includes mechanical grinding of the substrate back surface, followed by a series of chemical mechanical polishing steps and etching. The result is a TSV backside reveal of more than 10 micrometers, enhancing the efficiency of the substrate.

Career Highlights

Gu is currently employed at the National Center for Advanced Packaging Co., Ltd. His work focuses on developing advanced methods that improve the quality and performance of packaging materials. His expertise in polymer technology and TSV processes has positioned him as a key player in the field.

Collaborations

Gu collaborates with several professionals in his field, including Wenqi Zhang and Chongshen Song. These collaborations enhance the innovation process and contribute to the development of cutting-edge technologies.

Conclusion

Haiyang Gu's contributions to polymer surface treatment and TSV exposing processes demonstrate his commitment to advancing packaging technologies. His innovative patents reflect his expertise and the impact of his work in the industry.