National Center for Advanced Packaging Co., Ltd

Haiyang Gu

Wenqi Zhang

Ting Li

Chongshen Song

A method for polishing a polymer surface is provided by an embodiment of the present invention. The method includes: curing the polymer surface; polishing the polymer surface cured through a CMP process. By using the method for polishing a polymer surface provided by embodiments of the present invention, the mentioned problems in the prior art are solved. The uniformity of the polymer surface can be improved to &#x3c;1% through a CMP process, which can meet the requirements of high density and small linewidth integration.

Method for polishing a polymer surface

A TSV exposing process is provided, including: performing a mechanical grinding process on the substrate back surface of a substrate with a TSV conductive column, a liner between the substrate and the TSV conductive column; performing a first and a second chemical mechanical polishing process on the grinded substrate back surface; then performing an etching on the substrate back surface, and making the TSV backside reveal more than 10 &#x3bc;m.

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Wuxi, China

Haiyang Gu