The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Apr. 17, 2015
Applicant:
National Center for Advanced Packaging Co., Ltd., Wuxi, Jiangsu Province, CN;
Inventors:
Ting Li, Wuxi, CN;
Haiyang Gu, Wuxi, CN;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02065 (2013.01); H01L 21/02074 (2013.01); H01L 21/31058 (2013.01); H01L 21/3212 (2013.01); H01L 21/56 (2013.01); H01L 21/7684 (2013.01); H01L 21/76819 (2013.01);
Abstract
A method for polishing a polymer surface is provided by an embodiment of the present invention. The method includes: curing the polymer surface; polishing the polymer surface cured through a CMP process. By using the method for polishing a polymer surface provided by embodiments of the present invention, the mentioned problems in the prior art are solved. The uniformity of the polymer surface can be improved to <1% through a CMP process, which can meet the requirements of high density and small linewidth integration.