The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Nov. 04, 2013
Applicant:

National Center for Advanced Packaging Co., Ltd., Wuxi, Jiangsu Province, CN;

Inventors:

Wenqi Zhang, Wuxi, CN;

Haiyang Gu, Wuxi, CN;

Chongshen Song, Wuxi, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/3212 (2013.01); H01L 21/30625 (2013.01); H01L 21/76898 (2013.01); H01L 24/11 (2013.01);
Abstract

A TSV exposing process is provided, including: performing a mechanical grinding process on the substrate back surface of a substrate with a TSV conductive column, a liner between the substrate and the TSV conductive column; performing a first and a second chemical mechanical polishing process on the grinded substrate back surface; then performing an etching on the substrate back surface, and making the TSV backside reveal more than 10 μm.


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