Zhidan Fang

Title: Zhidan Fang: Innovator in Circuit Structure Technology

Introduction

Zhidan Fang is a notable inventor based in Beijing, China. He has made significant contributions to the field of circuit technology, particularly through his innovative methods for constructing external circuit structures. His work is recognized for its potential applications in advanced packaging technologies.

Latest Patents

Zhidan Fang holds a patent for a "Method for constructing an external circuit structure." This method is designed for use on an inner circuit substrate and involves several key steps. The process includes laminating a copper foil and a prepreg on the inner circuit substrate, drilling blind vias, and electroless copper plating to form a copper layer. This innovative approach enhances the efficiency and effectiveness of circuit construction.

Career Highlights

Zhidan Fang is associated with the National Center for Advanced Packaging Co., Ltd. His role at this institution allows him to engage in cutting-edge research and development in packaging technologies. His expertise in circuit design and construction has positioned him as a valuable asset in his field.

Collaborations

Zhidan Fang collaborates with talented colleagues, including Zhongyao Yu and Yu Sun. Their combined efforts contribute to advancements in circuit technology and packaging solutions.

Conclusion

Zhidan Fang's contributions to circuit structure technology exemplify innovation in the field. His patent and work at the National Center for Advanced Packaging Co., Ltd. highlight his commitment to advancing technology in circuit design.