The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Jun. 27, 2014
National Center for Advanced Packaging Co., Ltd., Wuxi, Jiangsu Province, CN;
National Center for Advanced Packaging Co., Ltd., Wuxi, Jiangsu, CN;
Abstract
A method for constructing an external circuit structure is provided. The method is applied to an inner circuit substrate, wherein, the method comprises: laminating a copper foil and a prepreg on the inner circuit substrate; wherein, the prepreg is laminated between the copper foil and the inner circuit substrate; drilling at least one blind via from the copper foil to reach the copper circuit of the inner circuit substrate; removing smear generated in the at least one blind via during the drilling process; corroding off the copper foil; electroless copper plating on the prepreg to form an electroless plating copper layer on the prepreg; wherein, during the electroless copper plating process, a swelling process without desmearing process is implemented.