Daquan Yu

Title: Daquan Yu: Innovator in Mechanical Debonding and Electropolishing Methods

Introduction

Daquan Yu is a prominent inventor based in Wuxi, China. He has made significant contributions to the field of advanced packaging technologies, holding two patents that showcase his innovative approach to solving complex manufacturing challenges.

Latest Patents

One of Daquan Yu's latest patents is a mechanical debonding method and system. This invention provides a mechanical debonding method used to debond temporary bonding wafers formed by bonding a device wafer and a carrier wafer with an adhesive. The method involves obtaining the height position of the adhesive through a thickness measurement apparatus, moving a cutting apparatus to a position between the device wafer and the carrier wafer based on the adhesive's height, and removing the adhesive at the edge of the temporary bonding wafers. The process concludes with cleaning the adhesive left on the surface of the device wafer.

Another significant patent is a method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing. This method avoids the use of CMP for eliminating electroplated copper facets and reusing the barrier layer in back-end manufacturing processes. Electropolishing is employed to remove the deposited surface metal, stopping at the barrier layer to create a smooth surface for subsequent steps. This method is particularly suitable for the electropolishing of metal surfaces after the formation of filled vias for through-silicon via processes using metals such as copper, tungsten, aluminum, or their alloys.

Career Highlights

Daquan Yu works at the National Center for Advanced Packaging Co., Ltd., where he applies his expertise in advanced packaging technologies. His innovative methods have the potential to enhance manufacturing efficiency and product quality in the semiconductor industry.

Collaborations

Daquan collaborates with talented coworkers, including Feng Jiang and Kai Xue, who contribute to the development of cutting-edge technologies in their field.

Conclusion

Daquan Yu is a notable inventor whose work in mechanical debonding and electropolishing methods reflects his commitment to innovation in advanced packaging technologies. His contributions are paving the way for advancements in the semiconductor manufacturing industry.