Location History:
- Bukit Batok Central, SG (2017)
- Wuxi, CN (2021)
Company Filing History:
1 out of 14 
1 out of 1 Years Active: 2017-2021
Title: Innovations of Tingyu Lin
Introduction
Tingyu Lin is a notable inventor based in Wuxi, China. He has made significant contributions to the field of sensor technology and heat dissipation solutions. With a total of two patents to his name, his work reflects a commitment to advancing technology in high-performance applications.
Latest Patents
Tingyu Lin's latest patents include a stress sensor structure and a manufacturing method thereof. This invention discloses a stress sensor structure that comprises a substrate with a blind-hole on its first surface. It features a first and second piezoresistive layer formed by materials with piezoresistive effects, interconnected at the bottom portions. A second insulating layer is provided between these layers, along with first and second electrodes connected to each piezoresistive layer. The resistance measured by applying an external voltage between the electrodes can indicate the stress of the TSV structure, particularly its axial stress. His second patent is a heat dissipation solution for advanced chip packages. This solution addresses the heat generated from high-power chip packages, such as fcBGA and 2.5D/3D TSV packages. The system includes a high-power chip package with a micro-jet and a micro-pump in fluidic communication with a heat exchanger, all assembled on the same PCB.
Career Highlights
Tingyu Lin has worked with reputable organizations, including the National Center for Advanced Packaging Co., Ltd and the National Center for Advanced Package. His experience in these institutions has allowed him to develop innovative solutions that enhance the performance and reliability of electronic devices.
Collaborations
Some of his notable coworkers include Fengze Hou and Wen Yin, who have contributed to his projects and innovations.
Conclusion
Tingyu Lin's contributions to sensor technology and heat dissipation solutions demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of the challenges in modern electronics and offer practical solutions to enhance performance.