Company Filing History:
1 out of 3,100 
1 out of 14 Years Active: 2017-2018
Title: Innovations of Xueping Guo in Packaging Technology
Introduction
Xueping Guo is a prominent inventor based in Beijing, China. He has made significant contributions to the field of packaging technology, particularly in the development of advanced methods and structures for chip packaging. With a total of two patents to his name, Guo's work focuses on enhancing the efficiency and performance of packaging solutions.
Latest Patents
One of Guo's latest patents is titled "Flexible-substrate-based three-dimensional packaging structure and method." This invention relates to a 3-D packaging structure that utilizes a flexible substrate. The method involves providing a bendable continuous flexible substrate, determining its shape based on the dies' size and quantity, and making surface wiring for interlayer electrical connections. The process includes welding dies onto the substrate, filling gaps with an underfill, and bending the substrate to align peripheral dies with the central die. This innovative approach allows for high-density packaging and improved performance.
Another notable patent is the "Chip embedded package method and structure." This method includes etching metallic sinks on a thicker metal layer of organic substrates. It allows for the packaging of at least one chip and the creation of via-holes. The process involves mounting chips into metallic sinks, combining organic substrates, and drilling blind-holes and via-holes to facilitate connections. This method enhances the integration and functionality of embedded chip packages.
Career Highlights
Xueping Guo has worked with esteemed organizations such as the Chinese Academy of Sciences and the National Center for Advanced Packaging Co., Ltd. His experience in these institutions has contributed to his expertise in packaging technologies and innovations.
Collaborations
Guo has collaborated with notable colleagues, including Yuan Lu and Zhongyao Yu. Their combined efforts have further advanced the field of packaging technology.
Conclusion
Xueping Guo's contributions to packaging technology through his innovative patents demonstrate his commitment to enhancing the efficiency and performance of chip packaging solutions. His work continues to influence the industry and pave the way for future advancements.