The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jun. 12, 2014
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, CN;
National Center for Advanced Packaging (Ncap China), Jiangsu, CN;
Xueping Guo, Beijing, CN;
Yuan Lu, Beijing, CN;
Abstract
The present invention mainly relates to a 3-D packaging structure based on a flexible substrate and a method for manufacturing the same; the method comprises: providing a bendable continuous flexible substrate, determining the shape of the substrate according to the size, the quantity and the shape of dies, and making surface wiring on the substrate to allow interlayer electrical connection; welding dies that are to be packaged onto the bendable continuous flexible substrate; filling the gaps between the dies and the substrate with an underfill; bending the substrates towards the center to allow the peripheral dies to coincide in parallel with the die situated at the center, and bonding the two layers of parallel dies with a bonding adhesive. As compared with the inventions available in the prior art, the present invention makes use of a flexible substrate as a packaging substrate, which can better satisfy the demand for high density and high levels of integration in packaging to achieve miniaturization of packaging, and realizes die packaging of good compatibility and better performance.