Chinese Academy of Sciences

National Center for Advanced Packaging Co., Ltd

Xueping Guo

Zhongyao Yu

Yuan Lu

The present invention mainly relates to a 3-D packaging structure based on a flexible substrate and a method for manufacturing the same; the method comprises: providing a bendable continuous flexible substrate, determining the shape of the substrate according to the size, the quantity and the shape of dies, and making surface wiring on the substrate to allow interlayer electrical connection; welding dies that are to be packaged onto the bendable continuous flexible substrate; filling the gaps between the dies and the substrate with an underfill; bending the substrates towards the center to allow the peripheral dies to coincide in parallel with the die situated at the center, and bonding the two layers of parallel dies with a bonding adhesive. As compared with the inventions available in the prior art, the present invention makes use of a flexible substrate as a packaging substrate, which can better satisfy the demand for high density and high levels of integration in packaging to achieve miniaturization of packaging, and realizes die packaging of good compatibility and better performance.

Flexible-substrate-based three-dimensional packaging structure and method

A chip embedded package method is provided by an embodiment of the present invention. The method comprises: etching metallic sinks on the thicker metal layer of each organic substrate; part of metallic sinks is used for packaging at least one chip, and other metallic sinks are used for via-holes; mounting the at least one chip into a metallic sink of each organic substrate via adhesive; flipping one organic substrate on another to form a combination; drilling blind-holes on both sides of the combination of the two organic substrates to pass through the adhesive; drilling via-holes to get through the combination of the two organic substrates, wherein the via-holes locates beyond the metallic sinks with chips; filling the blind-holes and via-holes with conductive medium through an electroplating process.

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Beijing, China

Xueping Guo