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For the Inventor, By the Inventor

Villach, Austria

Lam Research Ag


USPTO Granted Patents = 113

% Expired Patents = 24.8


Trademarks = 1

Forward Citations = 264

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122 inventors (with patents filed for the assignee):

goldMedal Rainer Obweger (19 out of 20 patents)

silverMedal Michael Brugger (18 out of 18 patents)

bronzeMedal Andreas Gleissner (16 out of 29 patents)

4.  Thomas Wirnsberger (13 out of 17 patents)

5.  Alexander Lippert (10 out of 10 patents)

6.  Philipp Engesser (9 out of 11 patents)

7.  Karl-Heinz Hohenwarter (9 out of 10 patents)

8.  Reinhold Schwarzenbacher (7 out of 7 patents)

9.  Ulrich Tschinderle (7 out of 7 patents)

10.  Franz Kumnig (7 out of 7 patents)

11.  Otto Lach (7 out of 7 patents)

12.  Michael Puggl (7 out of 7 patents)

13.  Dieter Frank (7 out of 7 patents)

14.  Bhaskar Bandarapu (5 out of 5 patents)

15.  David S Mui (5 out of 32 patents)


Core Competencies:
Wafer Processing
Liquid Treatment
Surface Treatment
High Aspect Ratio Structures
Cleaning Method
Gas Mixture
Spin Chuck
Etching Composition
Vapor Delivery
Rinsing Liquid
Wet-Dry Processing
Passivation Mixture

113 patents:

1. 12733448 - Apparatus for processing a wafer (2026-09-08),
2. 12701965 - Apparatus for processing a wafer-shaped article (2026-08-04),
3. 12538752 - Apparatus for processing a wafer-shaped article (2026-01-27),
4. 12512343 - Apparatus for dispensing a liquid (2025-12-30),
5. 12456644 - Apparatus for processing a wafer, and method of controlling such an apparatus (2025-10-28),
6. 12217980 - Apparatus for processing a wafer, and method of controlling such an apparatus (2025-02-04),
7. 12198945 - Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures (2025-01-14),
8. 11975992 - Method of producing rinsing liquid (2024-05-07),
9. 11854792 - Systems and methods for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures (2023-12-26),
10. 11823892 - Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structures (2023-11-21),
11. 11810796 - Wafer cleaning method and apparatus therefore (2023-11-07),
12. 11195730 - Method and apparatus for processing wafer-shaped articles (2021-12-07),
13. 10861719 - Method and apparatus for processing wafer-shaped articles (2020-12-08),
14. 10815573 - Passivation mixture and systems and methods for selectively passivating substrate materials including germanium or type III-IV materials using the passivation mixture (2020-10-27),
15. 10720343 - Method and apparatus for processing wafer-shaped articles (2020-07-21),
Lam Research Ag, headquartered in Villach, Austria, specializes in advanced wafer processing technologies essential for semiconductor manufacturing. The company focuses on critical areas such as liquid treatment, surface treatment, and the development of high aspect ratio structures. Lam Research Ag is recognized for its innovative cleaning methods, gas mixtures, and etching compositions, which are vital for enhancing the efficiency and performance of semiconductor devices. Their expertise supports the evolving demands of the global electronics industry.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

113 Patents

#2 in Villach

#27 in Austria

#6,993 in the World

Villach, AT
Villach, Austria

Lam Research Ag

Forward Citations = 264

122 inventors:

goldMedal Rainer Obweger (19 out of 20 patents)

silverMedal Michael Brugger (18 out of 18 patents)

bronzeMedal Andreas Gleissner (16 out of 29 patents)

4.  Thomas Wirnsberger (13 out of 17 patents)

5.  Alexander Lippert (10 out of 10 patents)

Please report any incorrect information to [email protected]
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