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For the Inventor, By the Inventor

Lam Research Ag


USPTO Granted Patents = 110


Trademarks = 2

Forward Citations = 242

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119 inventors (with patents filed for the assignee):

goldMedal Rainer Obweger (19 out of 20 patents)

silverMedal Andreas Gleissner (16 out of 28 patents)

bronzeMedal Michael Brugger (15 out of 15 patents)

4.  Thomas Wirnsberger (13 out of 17 patents)

5.  Alexander Lippert (10 out of 10 patents)

6.  Philipp Engesser (9 out of 11 patents)

7.  Karl-Heinz Hohenwarter (9 out of 10 patents)

8.  Reinhold Schwarzenbacher (7 out of 7 patents)

9.  Ulrich Tschinderle (7 out of 7 patents)

10.  Franz Kumnig (7 out of 7 patents)

11.  Otto Lach (7 out of 7 patents)

12.  Dieter Frank (7 out of 7 patents)

13.  Michael Puggl (6 out of 6 patents)

14.  Bhaskar Bandarapu (5 out of 5 patents)

15.  David S Mui (5 out of 32 patents)


Core Competencies:
Wafer Processing
Stiction Prevention
High Aspect Ratio Structures
Wafer Cleaning
Passivation Mixture
Spin Chuck Technology
Liquid Treatment
Surface Treatment
Ultrasonic Cleaning
Gas Mixture
Wet-Dry Integrated Processing
Vacuum Ultraviolet Exposure

110 patents:

1. 12512343 - Apparatus for dispensing a liquid (2025-12-30),
2. 12456644 - Apparatus for processing a wafer, and method of controlling such an apparatus (2025-10-28),
3. 12217980 - Apparatus for processing a wafer, and method of controlling such an apparatus (2025-02-04),
4. 12198945 - Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures (2025-01-14),
5. 11975992 - Method of producing rinsing liquid (2024-05-07),
6. 11854792 - Systems and methods for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures (2023-12-26),
7. 11823892 - Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structures (2023-11-21),
8. 11810796 - Wafer cleaning method and apparatus therefore (2023-11-07),
9. 11195730 - Method and apparatus for processing wafer-shaped articles (2021-12-07),
10. 10861719 - Method and apparatus for processing wafer-shaped articles (2020-12-08),
11. 10815573 - Passivation mixture and systems and methods for selectively passivating substrate materials including germanium or type III-IV materials using the passivation mixture (2020-10-27),
12. 10720343 - Method and apparatus for processing wafer-shaped articles (2020-07-21),
13. 10658204 - Spin chuck with concentrated center and radial heating (2020-05-19),
14. 10490426 - Method and apparatus for processing wafer-shaped articles (2019-11-26),
15. 10483010 - Reduction of surface and embedded substrate charge by controlled exposure to vacuum ultraviolet (VUV) light in low-oxygen environment (2019-11-19),
Lam Research Ag is a leading global supplier of wafer fabrication equipment and services for the semiconductor industry. They provide solutions to help customers build smaller, faster, and more powerful devices. With a focus on research and innovation, Lam Research is dedicated to advancing technology and driving the future of semiconductor manufacturing.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

110 Patents

#3 in

#75 in

#6,953 in the World

Lam Research Ag

Forward Citations = 242

119 inventors:

goldMedal Rainer Obweger (19 out of 20 patents)

silverMedal Andreas Gleissner (16 out of 28 patents)

bronzeMedal Michael Brugger (15 out of 15 patents)

4.  Thomas Wirnsberger (13 out of 17 patents)

5.  Alexander Lippert (10 out of 10 patents)

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